Process Capability

project 

technical standard

Remark

Number of layers

1-10 layers

12-16 layers can be produced in small batches

Material

CEM-3, FR-4

  

Board thickness

0.3mm-3.20mm (12mil-126mil) 

  

Minimum core thickness

0.1mm(4mil)

   

Copper thickness

1/2 oz min;3 oz max.

 

Minimum line width/spacing

0.1mm(4mil)

 

Minimum hole diameter

0.25mm(10mil)

  

Minimum punching aperture

0.9mm(35mil)

 

tolerance

Drilling hole position

±0.075mm(3mil)

  

Line width

±0.1mm(4mil) or ±20% of line width

 

Aperture

PTH±0.1mm(4mil)  NPTH±0.075mm(3mil) 

  

Overall tolerance

Milling machine ±0.15MM(6mil) Punch machine ±0.10mm(4mil)  

  

Warpage

0.70%-1%

  

Pad surface treatment

Nickel/Gold Plating/
Entek/Hot Air 
Leveling 

  

Insulation resistance

10KΩ-20MΩ

  

Conduction resistance

< 50Ω

  

Test voltage

150-300V

  

V carve

Jigsaw size

110 × 100mm (min.) 660 × 600mm (max.) 

  

Board thickness

0.6mm (24mil) min. 

 

Retain thickness

0.3mm(12mil)min.

 

tolerance

±0.1mm(4mil) 

  

Slot width 

0.50mm(20mil)max. 

  

Slot to slot 

10mm min. 

 

Slot to line

0.50mm(20mil)min. 


groove

Slot size tol.>=2W tolerance

PTH L:±0.15mm(6mil) 
W:±0.1mm(4mil) 

Where:L=Slot length 
W=Slot width Min.drill 
bit size or multi-drill is 0.7mm 

NPTH L:±0.125mm(5mil)
W:±0.1mm(4mil) 

Minimum hole to circle distance

PTH Hole:0.13mm(5mil) 


NPTH Hole:0.18(7mil) 

  

Registration Tolerance of 
Front/Back image

Circular deviation

0.075mm(3mil) 

  

Multilayer board

 

 

 

Interlayer deviation

4 layers:0.15mm(6mil)max. 


6 layers:0.025mm(10mil)max. 


Minimum hole to inner circle distance

0.25mm(10mil)


Minimum distance from board edge to inner circle

0.25mm(10mil) 


Board thickness tolerance

4 layers:±0.13mm(5mil) 


6 layers:±0.15mm(6mil) 


Characteristic impedance

60 ohm±10% 


product name:

Double-sided matt green oil spray tin plate

Product Description:

Spray tin plate: Process characteristics: Including copper and tin two layers of metal, in which Cu≥25μm, Sn≥5.0μm, its characteristics are that it can adapt to poor environmental conditions and has good soldering performance. It is a more suitable process in high temperature and corrosive environment.

Scope of application: demanding industrial control equipment products, communication products and business equipment products, instruments and military equipment products, etc.

The matt solder mask can protect the eyes of the welding workers and will not reflect light. It is generally required for European orders .

Product name :

Black solder mask double-sided nickel-plated gold plate

Product Description:

Nickel-plated gold plate: Process characteristics: The plating layer contains three layers of copper, nickel and gold, in which Ni≥2.5μm, AU≥0.02μm, which is characterized by large internal stress of the coating, good flatness and high wear resistance. However, the solderability is relatively poor. Scope of application: BONGDING boards and plug-in boards, general communication products, computer boards and consumer electronics, electronic toys, game consoles, etc. 

 

product name:

3-layer tin plate

Product Description:

Spray tin plate: Process characteristics: Including copper and tin two layers of metal, in which Cu≥25μm, Sn≥5.0μm, its characteristics are that it can adapt to poor environmental conditions and has good soldering performance. It is a more suitable process in high temperature and corrosive environment.

Scope of application: demanding industrial control equipment products, communication products and business equipment products, instruments and military equipment products, etc.

product name:

4-layer tin spray resistance board

Product Description:

Process characteristics: Including two layers of copper and tin, in which Cu≥25μm and Sn≥5.0μm, which are characterized by being able to adapt to poor environmental conditions and having good soldering properties. It is a more suitable process in high temperature and corrosive environment.
Scope of application: demanding industrial control equipment products, communication products and business equipment products, instruments and military equipment products, etc.
Used in communication, signal transmission.

product name:

Double-sided spray tin board

Product Description:

Spray tin plate:
Process characteristics: Including copper and tin two layers of metal, in which Cu≥25μm, Sn≥5.0μm, its characteristics are that it can adapt to poor environmental conditions and has good soldering performance. It is a more suitable process in high temperature and corrosive environment.
Scope of application: demanding industrial control equipment products, communication products and business equipment products, instruments and military equipment products, etc.
Remarks The PCB of this type of LED is the largest quantity of our company, and the monthly shipment is about 2000 square meters.

product name:

4- layer nickel-plated gold plate

Product Description:

Nickel-plated gold plate:
Process characteristics: The plating layer contains three layers of copper, nickel and gold, in which Ni≥2.5μm, AU≥0.02μm, which is characterized by large internal stress of the coating, good flatness and high wear resistance. However, the solderability is relatively poor.
Scope of application: BONGDING boards and plug-in boards, general communication products, computer boards and consumer electronics, electronic toys, game consoles, etc.

product name:

Spray tin plus gold finger board

Product Description:

Gold finger tin-spraying board:
Process characteristics: including three layers of nickel, gold and tin, in which Ni≥2.5μm, AU≥0.05μm, Sn≥5.0μm, and its obvious feature is that it has a high endurance and is often disassembled and assembled.
Scope of application: industrial control panels, communication equipment products, computer hand-inserted cards and computer external products, etc.

product name:

6-layer spray tin board

Product Description:

Spray tin plate:
Process characteristics: Including copper and tin two layers of metal, in which Cu≥25μm, Sn≥5.0μm, its characteristics are that it can adapt to poor environmental conditions and has good soldering performance. It is a more suitable process in high temperature and corrosive environment.
Scope of application: demanding industrial control equipment products, communication products and business equipment products, instruments and military equipment products, etc.

product name:

Double-sided nickel-plated gold plate

Product Description:

Nickel-gold plate:
Process characteristics: the coating contains three layers of copper, nickel and gold, in which Ni≥2.5μm, AU≥0.02μm, which is characterized by large internal stress of the coating and high wear resistance. However, the solderability is relatively poor.
Scope of application: BONGDING boards and plug-in boards, general communication products, computer boards and consumer electronics, electronic toys, game consoles, etc.